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The Allen-Bradley 2198-R031 passive shunt module includes an enclosure, a resistance rating of 33 Ohms, a continuous power rating of 3100, and an enclosure. This module has an approximate weight of 16.8 kilograms.
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| Manufacturer | Allen Bradley |
|---|---|
| Category | Drives |
| Product Line | Kinetix 5700 |
| Part Number | 2198-R031 |
| UPC | 887172444555 |
| Weight | 10.06 lbs (4.56 kg) |
| Type | Passive shunt module |
| Catalog | Accessories |
| Compatibility | Kinetix 5700 series |
| Clearances | 610 mm on top - 152 mm below |
| Removable cover | Yes |
| Resistance | 33 Ohms |
| Continuous power | 3100 |
| Grounding | Required |
| Enclosure | Yes |
The 2198-R031 module is a passive shunt module that has been designed and manufactured by Allen-Bradley. This shunt has been included in the Kinetix 5700 series. A passive shunt consists of an external module that provides an additional shunt capacity for different applications where the DC-bus power supply internal shunt capacity of the drive needs to be exceeded. This specific module comes with an enclosure and its structure is comprised of resistor coils. The Allen-Bradley 2198-R031 passive shunt module requires clearances of at least 610 millimeters above it and 152 millimeters on each side. This module comes with a removable cover and 5/16 Hex. screws. The drive can achieve its full performance by being mounted outside the drive cabinet with the removable cover facing up. This module is not intended to be used with regenerative bus supplies.
The Allen-Bradley 2198-R031 passive shunt module needs to be installed in a ventilated location to avoid overheating. To secure the module, it needs to be attached by using an M10 fastener. This module has a resistance rating of 33 Ohms, a continuous power rating of 3100, and an approximate weight of 16.8 kilograms. Note that for some technicians, this weight may cause the shunt module to be a lift hazard, so it is recommended to take care at all times when lifting the product. The Allen-Bradley 2198-R031 passive shunt module's enclosure needs to be attached to the panel by bonding to reduce electrical noise that is known as electromagnetic interference (EMI). This bonding needs to be a high-frequency bonding to ensure that it and the module will not be affected by EMI.