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FANUC Other A87L-0001-0017-08G

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A87L-0001-0017-08G

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The A87L-0001-0017-08G from FANUC is a specialized bubble memory PCB module designed for applications requiring efficient data storage and accessibility. Offering a memory capacity of 16 KB, this device is built with four layers of FR-4 material, ensuring robust performance under various conditions.

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Technical specifications for A87L-0001-0017-08G

ManufacturerFANUC
Product TypeBubble Memory PCB module
Product LineOther
Part NumberA87L-0001-0017-08G
SeriesPCBs
Memory Capacity16 KB
PCB Layers4
MaterialFR-4
Supply Voltage5 VDC
Power Consumption5 W
Access Time5 µs
Operating Temperature Range0 °C to +55 °C
Storage Temperature Range–20 °C to +60 °C
Humidity Range10% to 90% RH (non-condensing)
Altitude1000 m
Connector TypeEdge connector
MountingSlot-mounted
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The FANUC A87L-0001-0017-08G is a bubble memory PCB module, notable for its compact design and high efficiency in data management. It has a memory capacity of 16 KB, making it suitable for a variety of applications that require reliable data storage.

Constructed with four layers and made from FR-4 material, this module provides durability and stable operation. It draws a supply voltage of 5 VDC and operates with a power consumption of 5 watts, ensuring it remains energy efficient. Access to data is rapid, with an access time measured at 5 microseconds, allowing for fast retrieval and processing.

In terms of environmental conditions, this PCB module functions effectively in an operating temperature range of 0 °C to +55 °C. For storage, it can handle temperatures from -20 °C to +60 °C safely. Moreover, it operates optimally at humidity levels between 10% and 90% relative humidity, without the risk of condensation. The module can also perform at altitudes up to 1000 meters, ensuring versatility across different operational settings.

Connectivity is facilitated through an edge connector, while the module itself is designed for slot mounting, which streamlines installation. Weighing 160 grams and with dimensions of 100 mm by 65 mm, it presents a compact solution for integrating bubble memory technology in electronic systems.