Product image is representative; revision or series may vary. Contact us to request a specific version.
The FANUC A20B-3300-0490 is a C2 CPU module designed for efficient and reliable operation. It features a voltage rating of 3.3 V/5 V and operates effectively at altitudes of up to 2,000 meters.
We sell industrial automation parts backed by our free 2-Year DO Supply Warranty.
Same-day domestic and fast international shipping with UPS, FedEx, DHL, and more.
AMEX, Visa, MasterCard, Discover, wire transfer, net terms, and more.
Repairs and exchanges are available for all automation products.
Drop shipping, blind shipping, and account shipping with no extra fees.
| Manufacturer | FANUC |
|---|---|
| Product Type | C2 CPU Module |
| Product Line | Series 20 |
| Part Number | A20B-3300-0490 |
| Altitude | 2,000 m |
| Signal Levels | CMOS/TTL |
| Voltage Rating | 3.3 V/5 V |
| Cooling | Passive cooling |
| Operating Temperature Range | 0°C to 50°C |
| Storage Temperature Range | -20°C to 70°C |
| Humidity Range | 20% to 85% (non-condensing) |
| PCB Thickness | 1.6 mm |
| Interface | Backplane |
| Connector Type | Edge connector |
| Material | FR4 PCB |
| Memory | 64 MB DRAM |
The FANUC A20B-3300-0490 is a C2 CPU module, notable for its compact design and dependable performance across various industrial applications. Designed to operate at altitudes of up to 2,000 meters, it ensures smooth operation in diverse environments. The module operates on dual voltage levels of 3.3 V and 5 V, catering to a range of electronic systems.
It is constructed on a durable FR4 printed circuit board, measuring 1.6 mm in thickness. The module utilizes passive cooling to maintain optimal temperatures, eliminating the need for additional active cooling solutions. Operating temperatures range from 0°C to 50°C, while it can safely store data within a temperature range of -20°C to 70°C.
Humidity tolerance is rated between 20% and 85% non-condensing, ensuring robustness in various environmental conditions. The interface is designed for backplane connections, utilizing an edge connector for secure attachment. The compact dimensions of 120mm x 50mm and a weight of 0.3 kg make it suitable for high-density applications. Additionally, it features 64 MB of DRAM, providing necessary memory support for efficient processing tasks.