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FANUC Series 20 A20B-3400-0020

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A20B-3400-0020

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The FANUC A20B-3400-0020 is a CPU module that features integrated SDRAM technology for efficient processing. With a memory capacity of 32 MB, it is compatible with FANUC R-30iA and R-30iB robot controllers.

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Technical specifications for A20B-3400-0020

ManufacturerFANUC
Product TypeCPU Module with Integrated SDRAM
Product LineSeries 20
Part NumberA20B-3400-0020
Weight1.00 lbs (0.45 kg)
Integrated SDRAM Memory Capacity32 Megabytes (MB)
Memory TechnologySynchronous Dynamic RAM (SDRAM)
Physical DesignCompact PCB (Printed Circuit Board) Module
Controller CompatibilityDesigned for FANUC R-30iA/R-30iB Robot Controllers
Operational Temperature Range0°C to 55°C (32°F to 131°F)
Installation OrientationHorizontal mounting on main board
Backplane InterfaceDedicated backplane connector
Power EfficiencyLow power consumption with high performance
Electrical InterfaceHigh-speed digital I/O connectivity
Thermal ManagementPassive Cooling
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The A20B-3400-0020 CPU model from FANUC's Series 20 serves as a specialized CPU module equipped with integrated SDRAM. It boasts a memory capacity of 32 Megabytes, utilizing synchronous dynamic RAM (SDRAM) for efficient data processing.

Optimally engineered for use with FANUC R-30iA and R-30iB robot controllers, this compact printed circuit board (PCB) module ensures high compatibility within automation systems. The unit's design allows for horizontal installation on the main board, facilitating straightforward integration into existing setups.

Operating effectively within a temperature range of 0°C to 55°C (32°F to 131°F), the module is built to endure various environmental conditions. It connects to the main system through a dedicated backplane interface, offering reliable data exchange. The electrical interface features high-speed digital I/O connectivity, which supports swift communication with other components.

In terms of efficiency, the A20B-3400-0020 is designed for low power consumption while delivering high performance, making it suitable for demanding applications. Thermal management is addressed through passive cooling mechanisms, ensuring optimal operation without active fans or additional cooling systems.