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FANUC Series 20 A20B-3900-0286

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A20B-3900-0286

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The FANUC A20B-3900-0286 is a flash memory board, part of the Series 20 range, designed specifically for storing essential CNC firmware, NC programs, ladder logic, and system parameters. This component functions at an operating voltage of 3.3 volts and has a memory capacity of 32 MB.

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Technical specifications for A20B-3900-0286

ManufacturerFANUC
Product TypeROM/Flash Memory Board
Product LineSeries 20
Part NumberA20B-3900-0286
FunctionStores CNC firmware, NC programs, ladder logic, and system parameters
Memory TypeFlash Type
Memory Capacity32 MB
Operating Voltage3.3 V
Number of Connectors1
CompatibilityFANUC Series 16i/18i/21i-B, 0i-C, 30i/31i
Protection ClassIP20
Enclosure RatingNEMA 1
CoolingNatural
Maximum Ambient Temperature40 degrees Celsius
Minimum Ambient Temperature0 degrees Celsius
Maximum Operating Humidity80% (non-condensing)
Maximum Storage Humidity80% (non-condensing)
Maximum Altitude1000m above sea level

The FANUC A20B-3900-0286 belongs to the Series 20 collection and is a ROM/Flash memory board. This unit efficiently stores various critical applications, such as CNC firmware, NC programs, ladder logic, and system parameters. Designed to operate at a voltage of 3.3 V, the memory board has a total capacity of 32 MB, ensuring adequate space for essential data and programs.

For connectivity, the A20B-3900-0286 contains one connector, providing straightforward integration into compatible systems. The board is compatible with a range of FANUC series, including the 16i, 18i, 21i-B, 0i-C, and 30i/31i, making it valuable for users of these systems.

Housing protection falls within the IP20 class, indicating a degree of dust ingress protection, while it also meets NEMA 1 enclosure standards. The cooling method for this board is natural, facilitating necessary temperature regulation. It operates effectively within ambient temperatures ranging from 0 to 40 degrees Celsius, maintaining performance in standard operational conditions.

The maximum humidity for operation and storage is capped at 80% (non-condensing), ensuring that moisture does not adversely affect the memory components. Furthermore, this device can withstand altitudes up to 1000 meters above sea level, making it suitable for various installations where environmental factors might influence operation.