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IC693ACC334
The IC693ACC334 is an I/O module faceplate designed for use in GE Fanuc Emerson's PACSystems RX3i series. This component features a 24-pin male Fujitsu connector and facilitates simplified wiring for compatible I/O modules.
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Technical specifications for IC693ACC334
| Manufacturer | GE Fanuc Emerson |
|---|---|
| Product Line | RX3i PacSystem |
| Part Number | IC693ACC334 |
| Weight | 2.00 lbs (0.91 kg) |
| Product | Faceplate |
| Faceplate Type | I/O Module Faceplate |
| Connector Type | 24-Pin Male Fujitsu Connector |
| Compatible Module Type | 20 Screw Type I/O Modules |
| Function | Replacing Terminal Connectors and Simplifying Wiring for I/O Modules |
| Low-Density Faceplate | Yes |
| Compatible Cable Types | Unshielded 0.5, 1, 2, or 3-meter Cables with 24-pin D-Connectors Terminations on One End |
| Operating Temperature | -20 to 60 degrees Celsius |
| Storage Temperature | -40 to 85 degrees Celsius |
Designed specifically for the PACSystems RX3i series, the IC693ACC334 faceplate serves as an integral component for I/O modules. It features a 24-pin male Fujitsu connector, providing reliable connectivity. This faceplate enables the simplification of wiring, thereby replacing traditional terminal connectors for up to 20 screw-type I/O modules, which enhances the overall efficiency and ease of system installation.
Built to operate in conditions ranging from -20 to +60 degrees Celsius, it is suitable for various environments. The faceplate can also be stored under extreme conditions, rated for temperatures between -40 and 85 degrees Celsius. Its low-density design assures compatibility with unshielded cables of lengths such as 0.5, 1, 2, or 3 meters that feature 24-pin D-connector terminations on one end. The IC693ACC334 provides a practical solution in streamlining the connections for I/O modules in automation systems.
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