Product image is representative; revision or series may vary. Contact us to request a specific version.
The IC694CHS398 from GE Fanuc Emerson is a serial expansion backplane designed specifically for the RX3i PacSystem series. It offers five slots to enhance module connectivity and supports a steady operating voltage of 5 VDC, drawing a current of 170 mA and consuming 0.85 watts of power.
We sell industrial automation parts backed by our free 2-Year DO Supply Warranty.
Same-day domestic and fast international shipping with UPS, FedEx, DHL, and more.
AMEX, Visa, MasterCard, Discover, wire transfer, net terms, and more.
Repairs and exchanges are available for all automation products.
Drop shipping, blind shipping, and account shipping with no extra fees.
| Manufacturer | GE Fanuc Emerson |
|---|---|
| Product Type | Serial Expansion Backplane |
| Product Line | RX3i PacSystem |
| Part Number | IC694CHS398 |
| Weight | 1.25 lbs (0.57 kg) |
| UPC | 0 799705793422 |
| Number of Slots | 5 slots |
| Operating Voltage | 5 VDC |
| Internal Current Draw | 170 mA |
| Power Consumption | 0.85 W |
| Minimum Operating Temperature | 0 °C |
| Maximum Operating Temperature | 40 °C |
| Minimum Storage Temperature | 0 °C |
| Maximum Storage Temperature | 40 °C |
| Operating Humidity | 80% (Non-Condensing) |
| Storage Humidity | 80% (Non-Condensing) |
| Installation Altitude | 1000 MSL |
Within the GE Fanuc Emerson RX3i PacSystem series, the IC694CHS398 serves as a serial expansion backplane. This module enables the integration of additional components, featuring a total of five slots to facilitate various configurations. It operates efficiently at a nominal voltage of 5 VDC and draws an internal current of 170 mA.
The power consumption of the unit is registered at 0.85 watts, ensuring low energy usage during operation. Designed to withstand a temperature range from a minimum of 0°C to a maximum of 40°C, it is well-suited for a variety of environments. Similarly, the backplane is capable of being stored within the same temperature constraints, providing flexibility for installation and maintenance.
Humidity levels should not exceed 80%, and the backplane is designed for non-condensing conditions to ensure optimal functionality. Additionally, this backplane supports installations at altitudes up to 1000 meters above sea level, making it adaptable to diverse setups. With its thoughtful design, the IC694CHS398 stands as a reliable choice for expanding the capabilities of the RX3i PacSystem.
| Revision Part # | Also known as | |
|---|---|---|
| IC694CHS398A | IC694CHS398-A, Series A, Rev A | |
| IC694CHS398D | IC694CHS398-D, Series D, Rev D | |
| Don't see your particular revision? Contact us now. | ||