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IC693ACC306
The IC693ACC306 is a memory chip from the GE Fanuc Emerson Series 90-30, engineered for reliable performance in various applications. It uses EPROM technology and offers a memory density of 32K x 8 bits, functioning with a speed rating of 150 nanoseconds.
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Technical specifications for IC693ACC306
| Manufacturer | GE Fanuc Emerson |
|---|---|
| Product Type | Memory Chip |
| Product Line | Series 90-30 |
| Part Number | IC693ACC306 |
| Memory Type | EPROM |
| Memory Density | 32K x 8 bits per chip |
| Speed Rating | 150 nanoseconds |
| Vibration Tolerance | 1 G |
| Shock Rating | 15 G |
| Min. Operating Temperature | 0°C |
| Max. Operating Temperature | 55 °C |
| Min. Storage Temperature | -40°C |
| Max. Storage Temperature | 85°C |
| Min. Relative Humidity | 5% (Non-Condensing) |
| Max. Relative Humidity | 95% (Non-Condensing) |
The IC693ACC306 memory chip falls under the distinguished GE Fanuc Emerson Series 90-30. Designed primarily as an EPROM chip, it provides a memory capacity of 32K x 8 bits. This facilitates a speed performance of 150 nanoseconds, promoting effective data processing in suitable environments.
The chip is built to endure challenging conditions, rated for vibration tolerance up to 1 G and shock resistance up to 15 G. Such characteristics ensure operational stability in dynamic settings. Operating temperature parameters range from a minimum of 0°C to a maximum of 55°C, allowing for deployment in environments with moderate temperature variations.
In terms of storage, the IC693ACC306 can be kept at temperatures as low as -40°C and as high as 85°C, making it versatile for various storage conditions. The memory chip also maintains performance across a relative humidity range of 5% to 95% (non-condensing), further enhancing its adaptability in diverse applications. Overall, the IC693ACC306 is a robust memory solution for systems requiring reliable data retention and processing capabilities.
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