The IC610CCM110 is a local I/O link module developed by GE Fanuc Emerson, suitable for Series One and Series One Plus applications. This module facilitates remote I/O operations and is mounted on a CPU rack.
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Manufacturer | GE Fanuc Emerson |
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Series | Series One |
Part Number | IC610CCM110 |
Product Type | I/O Link Local Module |
Rack | CPU Rack |
Function | Remote I/O Applications |
Connected Module | I/O Link Remote Module in I/O Rack |
Connector Cable | 1 Twisted-Pair Cable |
Maximum Supported I/O | 112 I/O (Series One), 168 I/O (Series One Plus) |
Ambient Operating Temperature | 32 to 140 degrees Fahrenheit |
Ambient Storage Temperature | 14 to 158 degrees Fahrenheit |
Relative Humidity (Operation and Storage) | 5 to 95% (Non-Condensing) |
The IC610CCM110 I/O link local module belongs to the GE Fanuc Emerson Series One family, including the Series One Plus range. This module serves as an integral component for remote I/O applications, designed to be installed in a CPU rack.
It connects to an I/O link remote module within an I/O rack through a single twisted-pair cable, ensuring effective communication. This module supports a maximum of 112 input/output points in Series One configuration, while Series One Plus can accommodate up to 168 I/O points, providing flexibility for various applications.
The device operates reliably in ambient temperatures ranging from 32 to 140 degrees Fahrenheit, catering to different operational environments. For storage, it can handle conditions from 14 to 158 degrees Fahrenheit. Additionally, the module is designed to function in environments with relative humidity levels from 5% to 95% without condensation, making it versatile for both operation and storage.