The IC610CCM111 is categorized as an I/O Link remote module under the GE Fanuc Emerson Series One. It is utilized primarily for remote I/O applications and is compatible with I/O racks in the Series One and Series One Plus.
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Manufacturer | GE Fanuc Emerson |
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Series | Series One, Series One Plus |
Part Number | IC610CCM111 |
Product Type | I/O Link Remote Module |
Rack | I/O Rack |
Function | Remote I/O Applications |
Connected Module | I/O Link Local Module in CPU Rack |
Connector Cable | 1 Twisted-Pair Cable |
Maximum Supported I/O | 112 I/O (Series One), 168 I/O (Series One Plus) |
Operating Temperature | 32 to 140 degrees Fahrenheit |
Storage Temperature | 14 to 158 degrees Fahrenheit |
Relative Humidity (Operation and Storage) | 5 to 95% without Condensation |
The IC610CCM111 is a remote I/O module engineered for robust performance in diverse applications. Housed within the GE Fanuc Emerson Series One, this component serves a vital role in establishing communication between a central processing unit and peripheral I/O devices. Designed to fit into an I/O rack, it utilizes a single twisted-pair cable for connection, facilitating effective data transfer.
For installations on Series One systems, the module can support up to 112 I/O connections, while the Series One Plus can manage up to 168 I/O connections, allowing for scalability in I/O management. Operating temperatures for this device span from 32 to 140 degrees Fahrenheit, ensuring reliable function across various industrial environments. Additionally, it is suitable for storage in temperatures ranging from 14 to 158 degrees Fahrenheit.
The IC610CCM111 is designed to perform effectively with relative humidity levels ranging from 5% to 95% without the presence of condensation, making it dependable in challenging conditions. This I/O link remote module thus provides a comprehensive solution for remote I/O applications, ensuring connectivity and functionality within the specified environmental limits.