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GE Fanuc Emerson Series One IC610CCM111

Product image is representative; revision or series may vary. Contact us to request a specific version.

IC610CCM111

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The IC610CCM111 is categorized as an I/O Link remote module under the GE Fanuc Emerson Series One. It is utilized primarily for remote I/O applications and is compatible with I/O racks in the Series One and Series One Plus.

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Not an Authorized Distributor: DO Supply is not an authorized distributor for listed manufacturers or tradenames and therefore the manufacturer's warranty does not apply. All of our products come with DO Supply's 2-year warranty.
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Technical specifications for IC610CCM111

ManufacturerGE Fanuc Emerson
Product TypeI/O Link Remote Module
Product LineSeries One
Part NumberIC610CCM111
Weight2.00 lbs (0.91 kg)
SeriesSeries One, Series One Plus
RackI/O Rack
FunctionRemote I/O Applications
Connected ModuleI/O Link Local Module in CPU Rack
Connector Cable1 Twisted-Pair Cable
Maximum Supported I/O112 I/O (Series One), 168 I/O (Series One Plus)
Operating Temperature32 to 140 degrees Fahrenheit
Storage Temperature14 to 158 degrees Fahrenheit
Relative Humidity (Operation and Storage)5 to 95% without Condensation
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The IC610CCM111 is a remote I/O module engineered for robust performance in diverse applications. Housed within the GE Fanuc Emerson Series One, this component serves a vital role in establishing communication between a central processing unit and peripheral I/O devices. Designed to fit into an I/O rack, it utilizes a single twisted-pair cable for connection, facilitating effective data transfer.

For installations on Series One systems, the module can support up to 112 I/O connections, while the Series One Plus can manage up to 168 I/O connections, allowing for scalability in I/O management. Operating temperatures for this device span from 32 to 140 degrees Fahrenheit, ensuring reliable function across various industrial environments. Additionally, it is suitable for storage in temperatures ranging from 14 to 158 degrees Fahrenheit.

The IC610CCM111 is designed to perform effectively with relative humidity levels ranging from 5% to 95% without the presence of condensation, making it dependable in challenging conditions. This I/O link remote module thus provides a comprehensive solution for remote I/O applications, ensuring connectivity and functionality within the specified environmental limits.