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The A1SJ71T21B model from Mitsubishi is a key data link module in the A Series. This device efficiently manages communication across various speeds from 125 kbps to 1 Mbps, allowing for data transmission over distances of up to 1200 meters.
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| Manufacturer | Mitsubishi |
|---|---|
| Product Type | Data Link Module |
| Product Line | A Series |
| Part Number | A1SJ71T21B |
| Weight | 0.31 lbs (0.14 kg) |
| Current Consumption | 0.66 A |
| Dielectric Withstand Voltage | 500 Volts AC for 1 minute |
| Communication Speed | 125 kbps, 250 kbps, 500 kbps, and 1 Mbps |
| Communication Distance | Up to 1200 meters |
| Communication Method | Half duplex bit serial method |
| Insulation Resistance | 5 Megaohms |
| Number of Occupied I/O Points | 32 Points |
| Transmission Format Compatibility | HDLC |
| Min. Operating Temperature | 0 °C |
| Max. Operating Temperature | 55 °C |
| Operating Ambient Humidity | 10 - 90% (Non-condensing) |
The Mitsubishi A1SJ71T21B is a specialized data link module designed for efficient communication application. It features a current consumption of 0.66 A, making it practical for operations in various automation settings. This unit is constructed to withstand dielectric voltage up to 500 Volts AC for one minute, providing durability against electrical surges.
Communication is a vital aspect of this module, supporting speeds ranging from 125 kbps to 1 Mbps. It implements a half duplex bit serial method, allowing data to flow smoothly over distances reaching up to 1200 meters. The module is compatible with HDLC transmission formats, ensuring versatility in different systems.
With the capacity to occupy 32 I/O points, this module aids in expanding the functionalities of connected systems. It also operates effectively within a temperature bracket of 0 °C to 55 °C and is capable of handling ambient humidity from 10% to 90% without condensation impacting its performance. The insulation resistance measures at 5 Megaohms, reinforcing reliability in operation. Overall, the A1SJ71T21B serves as a robust component for enhancing communication in industrial environments.