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FX3G60MTDS
The Mitsubishi FX3G60MTDS is a main unit within the FX Series. It features RS-422 communication and supports an I/O configuration of 60 points. It operates within a wide temperature range and is suitable for various installation methods.
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Technical specifications for FX3G60MTDS
| Manufacturer | Mitsubishi |
|---|---|
| Product Line | FX Series |
| Part Number | FX3G60MTDS |
| Weight | 1.00 lbs (0.45 kg) |
| Product | Main unit |
| Communication Options | RS-422 |
| Approximate Mass | 0.90 kg |
| Installation Method | DIN rail or direct installation with M4 screws |
| Max Input/Output Points | 128 points (256 points with AnyWireASLINK or CC-Link) |
| Storage Temperature | -25 to 75 degrees Celsius |
| Contact Instruction Processing Time | 210 ns |
| Output Type | Transistor |
| Input/Output Points | 60 (36 inputs, 24 outputs) |
| Operating Temperature | 0 to 55 degrees Celsius |
| Input Type | 24V DC sink/source |
The Mitsubishi FX3G60MTDS is a main unit within the FX Series designed to fulfill a variety of automation tasks. It provides RS-422 communication options, enabling seamless integration into existing systems. This module includes 60 I/O points, consisting of 36 input points and 24 output points. The output type is transistor-based and supports a configuration of 24V DC in both sink and source types.
With a maximum capacity of 128 input/output points, this module can be expanded to accommodate 256 input/output points by utilizing AnyWireASLINK or CC-Link technologies. Its compact dimensions of 175 mm in width, 90 mm in height, and 86 mm in depth make it suitable for space-constrained installations. Weighing approximately 0.90 kg, it is manageable during setup.
For installation, users can choose to mount the unit on a DIN rail or directly with M4 screws, providing flexibility in various environments. Operationally, the FX3G60MTDS maintains functionality within an ambient temperature range of 0 to 55 degrees Celsius. In comparison, it can withstand temperatures as low as -25 degrees Celsius and as high as 75 degrees Celsius during storage.
Furthermore, the drive exhibits a rapid contact instruction processing time of 210 nanoseconds, ensuring swift response to control commands.
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