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Mitsubishi Melsec-Q Q173HCPU

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Q173HCPU

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The Mitsubishi Q173HCPU, part of the Melsec-Q series, is designed for advanced motion control applications. It can handle up to 32 axes and utilizes the SSCNET III communication protocol for integration.

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Technical specifications for Q173HCPU

ManufacturerMitsubishi
Product LineMelsec-Q
Part NumberQ173HCPU
Weight0.19 lbs (0.09 kg)
Motion Control Capacity32 Axes
Communication Ports1 x USB, SSCNET III
Supply Voltage5V DC
Mounting ModeBackplane / Rack Mount
Programming LanguagesLadder Diagram (LD), Structured Text (ST), Relay Symbol
Motion Control IntegrationSSCNET III Communication Protocol
I/O ControlSupports remote I/O
Ambient Temperature (Operation)0°C to 55°C
Ambient Temperature (Storage)-25°C to 75°C

Mitsubishi's Q173HCPU is a sophisticated Melsec-Q series CPU focusing on motion control precision. This module can manage up to 32 axes, making it suitable for complex automation tasks. It uses the SSCNET III protocol for smooth motion control integration, ensuring efficient communication with compatible devices.

Weighing just 0.18 kg, this device is relatively lightweight and designed for easy installation via backplane or rack mounting. It operates on a supply voltage of 5V DC, making it adaptable to various setups. The communication options include one USB port, enhancing connectivity within automated systems.

For programming, users have the flexibility to utilize several languages, including Ladder Diagram, Structured Text, and Relay Symbol, catering to diverse engineering preferences. Additionally, the Q173HCPU supports remote I/O control, facilitating the effective management of external input and output devices.

Its operation is rated for ambient temperatures ranging from 0°C to 55°C, while it can be safely stored in environments as cold as -25°C and as warm as 75°C. Collectively, these specifications highlight the robust capability of the Q173HCPU to perform reliably in a variety of industrial applications.