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Schneider Electric I-Line HCP32688

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HCP32688

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The HCP32688 panelboard is a product from Schneider Electric's I-Line series designed for high-capacity applications. This unit is built to handle a rated current of 800 Amps and is intended for installation within specified enclosures measuring 42 inches (1066.8 mm) and 68 inches (1727.2 mm).

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Technical specifications for HCP32688

ManufacturerSchneider Electric
Product LineI-Line
Part NumberHCP32688
UPC785901213192
Weight217.00 lbs (98.43 kg)
ProductPanelboard
Main TypeLugs
Width34.38 in.
Height48 in.
Product DestinationEnclosure HCP 42 in (1066.8 mm) 68 in (1727.2 mm)
Rated Current800 A
Mounting Space63 in.
Bus MaterialCopper
Maximum Ambient Temperature60 degrees Celsius
Minimum Ambient Temperature0 degrees Celsius
Maximum Operating Humidity80% RH (non-condensing)
Maximum Storage Humidity80% RH (non-condensing)
Maximum Operating Altitude1000 m above sea level

The HCP32688, produced by Schneider Electric, represents a robust solution in the realm of panelboards as part of the I-Line series. This unit is specifically configured with lugs as the main type and is engineered to support a substantial rated current of 800 Amps. Its physical dimensions measure 34.38 inches in width and 48 inches in height, designed to fit properly in designated enclosures with sizing of 42 inches (1066.8 mm) and 68 inches (1727.2 mm).

Construction of the panelboard features a copper bus, facilitating efficient electrical conductivity. It offers a mounting space that measures 63 inches, which ensures adequate room for installation and component arrangement. Operating temperature specifications indicate a tolerance from 0 degrees Celsius up to a maximum of 60 degrees Celsius.

The environmental conditions also allow for operation within a maximum relative humidity of 80% devoid of condensation, which is essential for maintaining performance and safety. Furthermore, this panelboard is capable of functioning effectively at altitudes reaching 1000 meters above sea level, making it adaptable to various geographic and climate settings.