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P5-984B-832
The P5-984B-832 is an I/O module designed by Schneider Electric under the Modicon 984 series. With a memory capacity of 32K, this module is equipped to handle various input and output operations effectively.
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Technical specifications for P5-984B-832
| Manufacturer | Schneider Electric |
|---|---|
| Product Type | I/O Module |
| Product Line | Modicon 984 |
| Part Number | P5-984B-832 |
| Weight | 32.00 lbs (14.51 kg) |
| Memory Capacity | 32K |
| Number of Boards | 7 |
| Mount Type | Chassis |
| Protection Class | IP20 |
| Enclosure Rating | NEMA 1 |
| Cooling | Natural |
| Maximum Ambient Temperature | 60 degrees Celsius |
| Minimum Ambient Temperature | 0 degrees Celsius |
| Maximum Operating Humidity | 95% (non-condensing) |
| Maximum Storage Humidity | 95% (non-condensing) |
| Maximum Altitude | 1000m above sea level |
The Schneider Electric P5-984B-832, part of the Modicon 984 series, serves as an efficient I/O module. It has a memory capacity of 32K, which allows for effective management of input and output processes. Designed to fit seamlessly into a chassis, this module can support a total of 7 boards, which enhances its functionality and expandability in complex systems.
In terms of environmental resilience, the P5-984B-832 features an IP20 protection class, ensuring basic defense against solid contaminants, while its enclosure rating meets NEMA 1 standards. Cooling is facilitated through natural airflow, which aids in maintaining optimal operational temperatures within the unit.
Operating conditions are well-defined, with a maximum ambient temperature threshold of 60 degrees Celsius and a minimum of 0 degrees Celsius, providing operational flexibility across a range of environments. Additionally, the module can withstand a maximum humidity level of 95% in non-condensing settings, both during operation and while in storage. It is capable of functioning effectively at altitudes of up to 1000 meters above sea level, making it suitable for a variety of industrial applications in diverse locations.
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