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Schneider Electric Modicon Quantum 140CRA93200

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140CRA93200

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The Schneider Electric 140CRA93200 is a RIO drop adaptor designed for integration within the Modicon Quantum series. This module supports up to 27 I/O expansion modules and utilizes a standard format.

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Technical specifications for 140CRA93200

ManufacturerSchneider Electric
Product LineModicon Quantum
Part Number140CRA93200
EAN3595861133785
Weight2.00 lbs (0.91 kg)
ProductRIO drop adaptor
Connectors2 connectors
Redundant CableSupported
Operating Temperature Range0°C to 60°C
Storage Temperature Range-40°C to 85°C
Maximum Number of I/O Expansion Modules27 modules
Cable Type75 Ohm coaxial cable
Transmission Rate1544 Mbit/s
Power Dissipation3.8W for 2 channels
Bus Current Requirement750 mA for 2 channels
Non-Condensing Relative Humidity95%
Module FormatStandard format
Rack MountingSupported

The 140CRA93200 from Schneider Electric is a specific RIO drop adaptor module intended for use within the Modicon Quantum series. This device is designed to accommodate up to 27 I/O expansion modules, thereby enhancing system scalability and flexibility. It provides two connectors to support the connection of devices, and redundant cable configurations are also feasible, which can increase system reliability in critical applications.

Operating in temperatures from 0°C to 60°C facilitates use in various environments, while the storage temperature range extends from -40°C to 85°C, ensuring safe operation even under extreme conditions. The module uses a 75 Ohm coaxial cable for transmission, achieving a high transmission rate of 1544 Mbit/s, which is crucial for data-intensive applications.

With a power dissipation of 3.8 watts across both channels and a bus current requirement of 750 mA for those channels, the 140CRA93200 maintains efficient power management. It also supports a non-condensing relative humidity of up to 95%, making it suitable for diverse operational settings. The device weighs approximately 540 grams and supports rack mounting, providing ease of installation in standard enclosures. The overall design adheres to a standard module format, facilitating compatibility and integration into existing systems.