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Schneider Electric Modicon TSX TSXP57352M

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TSXP57352M

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The TSXP57352M from Schneider Electric is a PLC processor module that operates within the Modicon TSX series. It features 80 Kwords of internal RAM for both program and data storage, and requires a 5 VDC power supply sourced from the rack backplane.

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Technical specifications for TSXP57352M

ManufacturerSchneider Electric
Product TypePLC Processor Module
Product LineModicon TSX
Part NumberTSXP57352M
Weight0.88 lbs (0.40 kg)
Internal RAM80 Kwords (program and data)
Power Supply Voltage5 VDC (internal, via the rack backplane)
Operating Temperature Range0 to 60°C
Storage Temperature Range-25 to 70°C
Humidity Range10 to 95% (Non-Condensing)
Installation Altitude0 to 2000 m
IP RatingIP20
Communication Ports2 terminal ports (TER and AUX), and PCMCIA type III slot for a network card
Bus InterfaceX-Bus (backplane)
Module FormatDouble format (occupies 2 rack slots)
Real-Time ClockBuilt-in, battery-backed
Mounting TypeRack-mounted

The TSXP57352M PLC processor module is a core component from Schneider Electric's Modicon TSX series. This module is notable for its internal RAM capacity, which stands at 80 Kwords, allowing for substantial program and data processing capabilities. A 5 VDC power supply, derived from the rack's backplane, is essential for operation.

With an operational temperature range between 0 and 60°C, this module is equipped to function reliably within a variety of industrial settings. It can also tolerate storage temperatures ranging from -25 to 70°C, making it suitable for diverse environmental conditions. In terms of installation considerations, it supports altitudes of up to 2000 m. The module also maintains an IP20 protection rating, providing adequate defense against dust and solid objects of significant size.

Equipped with two terminal communication ports, namely TER and AUX, the configuration allows for flexible connectivity options. Additionally, this module includes a PCMCIA type III slot, facilitating network interface expansion. The bus interface utilized is the X-Bus, connecting to the backplane for efficient data handling.

The TSXP57352M is designed in a double format, occupying two slots within the rack framework, while its mounting type is rack-mounted. Furthermore, the processor features a built-in real-time clock that is battery-backed, ensuring accurate operational timing across various applications. Overall, this module is crafted for demanding automation tasks, prioritizing performance and reliability.