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Schneider Electric Modicon TSXP87420E

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TSXP87420E

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The TSXP87420E processor module from Schneider Electric's Modicon series is designed for versatile control applications. It operates with a power supply of 24 V DC and a clock speed of 33 MHz, delivering reliable performance in various environments.

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Technical specifications for TSXP87420E

ManufacturerSchneider Electric
Product TypeCPU / Processor Module
Product LineModicon
Part NumberTSXP87420E
Weight2.56 lbs (1.16 kg)
MemoryRAM / EEPROM
Communication SlotsOne serial port
Expansion SupportYes
Power Supply24 V DC
Clock Speed33 MHz
Shock Resistance15 G
Vibration Resistance2 G
Status IndicatorLEDs
Operating Temperature0 °C to +55 °C
Storage Temperature−25 °C to +70 °C
Relative Humidity5–95% RH non-condensing
ConnectorsEdge connectors
ConnectivityRack bus

Within the Modicon series, the TSXP87420E operates as a CPU or processor module that ensures competent control for industrial tasks. It includes a combination of RAM and EEPROM memory for effective data processing and retention. The power required for this module is 24 V DC, ensuring compatibility across various applications. With a clock speed set at 33 MHz, it is engineered to handle instructions swiftly. The component weighs 0.45 kg, providing a balance of performance and compactness.

Connectivity is enhanced through a single serial communication slot, making it easier to integrate into existing systems. Additional expansion capabilities further augment its utility, accommodating various application requirements.

This module showcases robust resistance to environmental stresses. It can endure shocks of up to 15 G and vibrations reaching 2 G, promoting operational stability in dynamic settings. Indicator LEDs serve to provide status feedback, allowing for simplified diagnostics.

In terms of environmental conditions, the TSXP87420E operates efficiently in temperatures from 0 °C to 55 °C. For storage, it can withstand down to -25 °C and up to 70 °C. It is also rated for a relative humidity of 5% to 95%, assuming non-condensing conditions during operation, which aids in ensuring durability in various industrial environments. The module connects via edge connectors and utilizes a rack bus for seamless communication within its designated architecture.