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The TSXP87420E processor module from Schneider Electric's Modicon series is designed for versatile control applications. It operates with a power supply of 24 V DC and a clock speed of 33 MHz, delivering reliable performance in various environments.
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| Manufacturer | Schneider Electric |
|---|---|
| Product Type | CPU / Processor Module |
| Product Line | Modicon |
| Part Number | TSXP87420E |
| Weight | 2.56 lbs (1.16 kg) |
| Memory | RAM / EEPROM |
| Communication Slots | One serial port |
| Expansion Support | Yes |
| Power Supply | 24 V DC |
| Clock Speed | 33 MHz |
| Shock Resistance | 15 G |
| Vibration Resistance | 2 G |
| Status Indicator | LEDs |
| Operating Temperature | 0 °C to +55 °C |
| Storage Temperature | −25 °C to +70 °C |
| Relative Humidity | 5–95% RH non-condensing |
| Connectors | Edge connectors |
| Connectivity | Rack bus |
Within the Modicon series, the TSXP87420E operates as a CPU or processor module that ensures competent control for industrial tasks. It includes a combination of RAM and EEPROM memory for effective data processing and retention. The power required for this module is 24 V DC, ensuring compatibility across various applications. With a clock speed set at 33 MHz, it is engineered to handle instructions swiftly. The component weighs 0.45 kg, providing a balance of performance and compactness.
Connectivity is enhanced through a single serial communication slot, making it easier to integrate into existing systems. Additional expansion capabilities further augment its utility, accommodating various application requirements.
This module showcases robust resistance to environmental stresses. It can endure shocks of up to 15 G and vibrations reaching 2 G, promoting operational stability in dynamic settings. Indicator LEDs serve to provide status feedback, allowing for simplified diagnostics.
In terms of environmental conditions, the TSXP87420E operates efficiently in temperatures from 0 °C to 55 °C. For storage, it can withstand down to -25 °C and up to 70 °C. It is also rated for a relative humidity of 5% to 95%, assuming non-condensing conditions during operation, which aids in ensuring durability in various industrial environments. The module connects via edge connectors and utilizes a rack bus for seamless communication within its designated architecture.