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The Schneider Electric TSXPCM00 is a compact, PC-compatible MMI module designed to enhance connectivity and user interaction with Modicon systems. It features a plug-in accessory form factor and connects through a dedicated slot for easy installation.
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| Manufacturer | Schneider Electric |
|---|---|
| Product Type | PC-Compatible MMI Module |
| Product Line | Modicon |
| Part Number | TSXPCM00 |
| Weight | 2.56 lbs (1.16 kg) |
| Form Factor | Compact module, plug-in accessory |
| Mounting | Connects via dedicated TSX accessory slot |
| Interface Connector | DB9 RS-232 serial connector |
| Communication Protocol | Modbus RTU and Uni-Telway |
| Data Rate | 19,200 bps |
| Cable Type | Standard serial cable |
| Operating Voltage | 5 V DC |
| Power Consumption | 1 W |
| EMC Compliance | Yes |
| Relative Humidity | 5 % to 95 % non‑condensing |
| Operating Temperature | 0 to +55 °C |
| Storage Temperature | -25°C to 70°C |
The TSXPCM00 by Schneider Electric acts as a PC-compatible MMI module specifically tailored for Modicon configurations. This unit boasts a compact design, and it easily connects via a dedicated TSX accessory slot, making integration straightforward. Its interface utilizes a DB9 RS-232 serial connector, compatible with standard serial cables, ensuring effective communication with external devices.
Implementing communication protocols such as Modbus RTU and Uni-Telway, this module facilitates a data transmission rate of up to 19,200 bps. Standard operating conditions allow for an input voltage of 5 V DC while consuming just 1 watt of power.
From an operational standpoint, the TSXPCM00 is equipped to function in temperatures spanning from 0 to +55 °C, making it suitable for various environments. It additionally supports a relative humidity range of 5% to 95% without condensation. For storage, this module can endure temperatures between -25°C and 70°C, enhancing its reliability. Weighing in at 300 grams and measuring 120 mm in length, 80 mm in width, and 40 mm in height, the TSXPCM00 remains a lightweight and compact solution for enhancing machine-to-human interfaces in Modicon systems.