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TSXRAM3216
The TSXRAM3216 is a memory module from Schneider Electric's Modicon series. This RAM type component boasts a 32K word capacity and is designated as a spare part or accessory for optimal system performance.
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Technical specifications for TSXRAM3216
| Manufacturer | Schneider Electric |
|---|---|
| Product Line | Modicon |
| Part Number | TSXRAM3216 |
| Weight | 0.13 lbs (0.06 kg) |
| Type | Memory Module |
| Memory Type | RAM |
| Spare Part/Accessory | Yes |
| Capacity | 32K Words |
| CE Marked | Yes |
| Operating Temperature | 0 to 40 degrees Celsius |
| Storage Temperature | 0 to 50 degrees Celsius |
| Maximum Operating Humidity | 80% (non-condensing) |
| Maximum Storage Humidity | 80% (non-condensing) |
| Maximum Operating Altitude Without Derating | 1000 meters above sea level |
| Maximum Storage Altitude | 1000 meters above sea level |
| Environment | Clean indoor environment with no corrosive chemicals |
The Schneider Electric TSXRAM3216 is a dedicated memory module that serves as a crucial component in Modicon series systems. Featuring a RAM memory type, it offers a capacity of 32K words, making it a reliable choice for diverse applications requiring memory expansion. The device is classified as a spare part or accessory, ensuring the capability for easy replacement and maintenance.
This module complies with CE safety standards, highlighting its quality and reliability in operation. It is built to function within an operating temperature range of 0 to 40 degrees Celsius, enabling it to handle various environmental conditions. Furthermore, it can safely be stored at temperatures reaching up to 50 degrees Celsius. When it comes to humidity, the TSXRAM3216 can withstand a maximum operating humidity of 80% without condensation.
With respect to elevation, this memory module performs well at altitudes up to 1000 meters above sea level, both during operation and storage. It is ideally used in a clean indoor environment, free from corrosive chemicals, to ensure prolonged durability and effectiveness. Weighing approximately 0.2 pounds, this component represents a compact yet significant part of system architecture.
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