Product image is representative; revision or series may vary. Contact us to request a specific version.
The Schneider Electric AS-BDAP-250C from the TSX COMPACT series is a discrete I/O module that incorporates electrical isolation. The device operates on a voltage rating of 24 VDC and offers a configuration of 8 discrete inputs alongside 8 discrete outputs, optimized for digital signal processing.
We sell industrial automation parts backed by our free 2-Year DO Supply Warranty.
Same-day domestic and fast international shipping with UPS, FedEx, DHL, and more.
AMEX, Visa, MasterCard, Discover, wire transfer, net terms, and more.
Repairs and exchanges are available for all automation products.
Drop shipping, blind shipping, and account shipping with no extra fees.
| Manufacturer | Schneider Electric |
|---|---|
| Product Type | Discrete I/O Module with Isolation |
| Product Line | TSX COMPACT |
| Part Number | AS-BDAP-250C |
| Voltage Rating | 24 VDC Input/Output Channels |
| I/O Configuration | 8 Discrete Inputs / 8 Discrete Outputs |
| Isolation Type | Channel-to-Channel Electrical Isolation |
| Operating Temperature Range | Extended Range (-25°C to +70°C) |
| Protection Class | Conformal Coating for Dust/Moisture Resistance |
| Communication Interface | Compatible with Modicon TSX Compact Backplane |
| Mounting Style | DIN Rail or Panel Mountable |
| Input/Output Type | Digital Discrete Signals (Sinking/Sourcing) |
| Heat Dissipation | <5 W (Typical for Low-Power I/O Modules) [Inferred] |
| Isolation Voltage | 1500 VAC Between Channels and Field |
The AS-BDAP-250C by Schneider Electric is a discrete I/O module designed for versatile applications. This unit is capable of handling 24 VDC for its input and output channels. It supports 8 discrete inputs and 8 discrete outputs, making it suitable for various digital signal processing tasks.
A notable feature is the channel-to-channel electrical isolation, enhancing system integrity and safeguarding against disturbances. The module is engineered to function within an extended temperature scope of -25°C to +70°C, ensuring operational reliability in diverse environments.
Protection against environmental factors is achieved through a conformal coating, which shields the module from dust and moisture. Additionally, this component communicates seamlessly with the Modicon TSX Compact backplane. Users have the flexibility to mount it using a DIN rail or panel configuration, accommodating different installation scenarios.
The module is designed to manage digital discrete signals while either sinking or sourcing current as required. Its dimensions are 30 cm in length, 20 cm in width, and 20 cm in height, with a weight of only 0.53 kg, contributing to its compact design. Heat dissipation is kept to a minimum, typically less than 5 watts, promoting energy efficiency. The isolation voltage rated at 1500 VAC between channels and the field ensures robust protection in operational setups.