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Siemens SIMATIC 6AV6644-0BA01-2AX0

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6AV6644-0BA01-2AX0

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The Siemens 6AV6644-0BA01-2AX0 is a versatile multi-panel featuring a 12-inch color TFT display that provides a clear resolution of 800 x 600 pixels. With a memory capacity of 12 MB, it supports reliable performance for various applications across varying environmental conditions.

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Technical specifications for 6AV6644-0BA01-2AX0

ManufacturerSiemens
Product LineSIMATIC
Part Number6AV6644-0BA01-2AX0
UPC662643396997
Weight20.00 lbs (9.07 kg)
ProductMulti Panel
Display Size12 inches
Display TypeColor TFT
Memory Capacity12 MB
Display Resolution800x600 pixels
Interfaces1 x RS422, 1 x RS485, 2 x Ethernet (RJ45)
Minimum Ambient Temperature0 degrees Celsius
Maximum Ambient Temperature60 degrees Celsius
Operating Humidity (Non-Condensing)80% RH max.
Storage Humidity (Non-Condensing)80% RH max.
Maximum Operating Altitude1000 meters above sea level
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The Siemens 6AV6644-0BA01-2AX0 multi-panel features a robust 12-inch color TFT screen, providing a crisp and detailed display at a resolution of 800 x 600 pixels. Weighing in at 7.3 kg, this panel is built for durability and ease of mounting in various settings. It boasts a memory capacity of 12 MB, which is adequate for handling application tasks efficiently.

For connectivity, this multi-panel is well-equipped with several interfaces: one RS-422 port, one RS-485 port, and two Ethernet ports (RJ-45), allowing for versatile communication with other devices in the network. This functionality is essential for integrations in automated environments.

The operational conditions for this panel are suitable for various industrial environments, with a minimum ambient temperature of 0°C and a maximum of 60 °C. It can withstand a relative humidity of up to 80% without condensation, making it suitable for areas with varying moisture levels. Additionally, the panel is rated for altitudes of up to 1000 meters above sea level, ensuring its reliability even in elevated locations. The unit's dimensions are 483 x 310 x 59 mm, allowing for straightforward placement and installation within existing infrastructure.