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The IC693ACC311 from GE Fanuc Emerson is designed specifically as an I/O terminal board kit for RX3i PLC I/O systems. This kit includes six backplane-mounted terminal boards for flexible installation and connection.
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| Manufacturer | GE Fanuc Emerson |
|---|---|
| Product Type | I/O terminal board kit |
| Product Line | RX3i PacSystem |
| Part Number | IC693ACC311 |
| Weight | 2.00 lbs (0.91 kg) |
| Compatible System | RX3i PLC I/O |
| Included Quantity | 6 terminal boards |
| Mounting Style | Backplane-mounted |
| Connection Method | Screw terminals |
| Power Needs | Powered by I/O module |
| Interface Type | Direct I/O mating |
| Altitude Rating | Indoor control rooms |
| Current Capacity | Supports up to 3 A total current and 1 A per path |
| Minimum Circuits Supported | 24 circuits minimum |
| Operating Temperature | 0 to 40 °C |
| Storage Temperature | 0 to 70 °C |
The GE Fanuc Emerson IC693ACC311 is an I/O terminal board kit intended for use with RX3i PLC I/O systems. This kit provides six terminal boards that facilitate backplane mounting for streamlined integration into control systems. Each board utilizes screw terminals for secure connections, ensuring stability during operation.
The power for these terminal boards is supplied by the associated I/O module, allowing for straightforward integration into the RX3i framework. These boards employ a direct I/O mating interface, allowing for efficient communication and data exchange.
With an indoor altitude rating, the IC693ACC311 is suitable for installation in control rooms, guaranteeing reliable performance across typical environmental conditions. This kit supports a minimum of 24 circuits and has a total current capacity of up to 3 A. Individual paths can sustain current levels up to 1 A. Operating temperature specifications range from 0 to 40 °C, while storage conditions can be sustained between 0 and 70 °C, ensuring the kit can be reliably stored or operated in varying conditions.