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GE Fanuc Emerson RX3i PacSystem IC694ACC310

Product image is representative; revision or series may vary. Contact us to request a specific version.

IC694ACC310

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The IC694ACC310 is a slot filler module unit that is part of the PACSystem RX3i, formerly by GE Intelligent Platforms (GE IP), now under Emerson Automation. This module is designed to preserve the electronic circuitry by covering the vacant slot. This module is essentially a module case without electronic components.

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Technical specifications for IC694ACC310

ManufacturerGE Fanuc Emerson
Product TypeBlank slot filler module
Product LineRX3i PacSystem
Part NumberIC694ACC310
Weight0.25 lbs (0.11 kg)
SeriesPACSystem RX3i
CompatibilityGE RX3i PACSystem
Product DescriptionSlot cover
Vibration PreventionSupported
No. of slots coveredSingle slot
Water Damage PreventionSupported
Compatible controllerAll RX3i CPUs
Compatible rackMain rack, Expansion / Remote racks
Compatible Standard Baseplates7, 12, and 16-slot baseplates
Removal and Insertion Under PowerAllowed
Compatible Expansion Baseplates5 and 10-slot baseplates
No. of module installationsUnlimited
Scalable SystemsSupported
Backplane Current drawNone
Status LED indicatorsNone
Programming requiredNone
CommunicationNone
No. of I/OsNone
Product LifecycleActive

The IC695ACC310 is a Slot filler module that is an accessory component for the PACSystem RX3i Programmable Automation Controller (PAC) Series formerly by GE Intelligent Platforms, currently under Emerson Automation. This module sometimes referred to as a dummy module, slot cover, or a blank module is mainly used to protect the exposed electronic circuitry of a vacant slot from the accumulation of industrial contaminants such as dust and dirt as well as prevent splashes of water, oil, grease, and similar contaminants. In addition, slot covers may provide protection against conductive debris such as metal produced by the drilling operation. The IC695ACC310 covers a single vacant slot and is not required to develop a functioning PACSystem configuration as the IC695ACC310 does not connect to the backplane. This module can be inserted and removed under power however, careful attention to the adjacent modules must be practiced avoiding the adjacent modules from being removed from the respective insertion points. Vacant slots are created when designing a flexible and modular system. For future modifications and system upgrades, vacant slots are left to retain the strategic arrangement of modules. In addition, the IC694ACC310 can be installed on any PACSystem RX3i rack or baseplate such as the main rack, expansion rack, or remote rack. There is no limit to the number of installation instances of the IC694ACC310. The IC694ACC310 physical appearance and measurement are typical to actual I/O modules except that the IC694ACC310 slot filler does not have LED status indicators and individual channel LED indicators. The material of this slot cover module is the same as the materials of I/O modules

The IC694ACC310 module is a blank slot filler module. The IC694ACC310 module is manufactured by GE Fanuc for use in the GE RX3i PacSystem, which is a scalable and high-performance control system which supports the PacSystems engine. This system is rack-based and is built according to the PCI standards. The features of RX3i PacSystems include Profinet for real-time I/O control, Proficy Machine Edition software for the development and configuration of control functions, the PacMotion controller for machine automation, and hot-standby redundancy control. The RX3i Pacsystems baseplates are available in 16, 12, and 7-slot configurations and they support hot-swapping capabilities for downtime reduction. Expansion baseplates are available in 10 and 5-slot versions. The IC694ACC310 module is primarily used for cosmetic purposes.

Revision Part #Also known as
IC694ACC310AIC694ACC310-A, Series A, Rev A
IC694ACC310BIC694ACC310-B, Series B, Rev B
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