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GE Fanuc Emerson Versamax IC200TBM001

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IC200TBM001

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The IC200TBM001 from GE Fanuc Emerson is an auxiliary I/O terminal strip designed primarily for expanded wiring connections. This barrier-style terminal strip accommodates six terminals and offers an 18-point configuration.

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Technical specifications for IC200TBM001

ManufacturerGE Fanuc Emerson
Product TypeI/O Auxiliary Terminal Strip
Product LineVersamax
Part NumberIC200TBM001
Weight0.13 lbs (0.06 kg)
StyleBarrier Style
Terminals6
Point18 Point
FunctionProvides additional wiring connection
Operating Temperature0 to 60 degrees Celsius
CertificationsUL, cUL, CE
MountingSnap on
Spare Part/AccessoryYes
Storage Temperature-40 to 85 degrees Celsius
Shock Rating15G for 11 ms
Relative Humidity5% to 95%, non-condensing

Designed to expand connectivity options, the GE Fanuc Emerson IC200TBM001 serves as an I/O auxiliary terminal strip within the Versamax series. It is engineered with six terminals, offering functionality across an 18-point configuration, which is crucial for providing further wiring connections. This barrier-style strip is well-suited for various industrial environments, given its operating temperature range of 0 to 60 degrees Celsius. It can manage diverse applications effectively under these temperature conditions.

The unit's storage capabilities are just as robust, functionally supporting extreme temperatures from -40 to 85 degrees Celsius. This factor enhances the terminal strip's versatility and reliability in different conditions. Installation is simplified with a snap-on mounting design, facilitating quick setup without additional hardware. This product also boasts certifications from UL, cUL, and CE, establishing compliance with recognized safety and quality standards. Furthermore, it can endure significant shocks, rated to handle up to 15G over 11 milliseconds, and operates efficiently in environments with relative humidity levels from 5% to 95%, ensuring non-condensing conditions. Overall, the IC200TBM001 is an accessory that extends connectivity and robustness for I/O applications.