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The IC200TBM001 from GE Fanuc Emerson is an auxiliary I/O terminal strip designed primarily for expanded wiring connections. This barrier-style terminal strip accommodates six terminals and offers an 18-point configuration.
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| Manufacturer | GE Fanuc Emerson |
|---|---|
| Product Type | I/O Auxiliary Terminal Strip |
| Product Line | Versamax |
| Part Number | IC200TBM001 |
| Weight | 0.13 lbs (0.06 kg) |
| Style | Barrier Style |
| Terminals | 6 |
| Point | 18 Point |
| Function | Provides additional wiring connection |
| Operating Temperature | 0 to 60 degrees Celsius |
| Certifications | UL, cUL, CE |
| Mounting | Snap on |
| Spare Part/Accessory | Yes |
| Storage Temperature | -40 to 85 degrees Celsius |
| Shock Rating | 15G for 11 ms |
| Relative Humidity | 5% to 95%, non-condensing |
Designed to expand connectivity options, the GE Fanuc Emerson IC200TBM001 serves as an I/O auxiliary terminal strip within the Versamax series. It is engineered with six terminals, offering functionality across an 18-point configuration, which is crucial for providing further wiring connections. This barrier-style strip is well-suited for various industrial environments, given its operating temperature range of 0 to 60 degrees Celsius. It can manage diverse applications effectively under these temperature conditions.
The unit's storage capabilities are just as robust, functionally supporting extreme temperatures from -40 to 85 degrees Celsius. This factor enhances the terminal strip's versatility and reliability in different conditions. Installation is simplified with a snap-on mounting design, facilitating quick setup without additional hardware. This product also boasts certifications from UL, cUL, and CE, establishing compliance with recognized safety and quality standards. Furthermore, it can endure significant shocks, rated to handle up to 15G over 11 milliseconds, and operates efficiently in environments with relative humidity levels from 5% to 95%, ensuring non-condensing conditions. Overall, the IC200TBM001 is an accessory that extends connectivity and robustness for I/O applications.