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The IC600YB947 is part of the GE Fanuc Emerson Versamax series, designed specifically as a link I/O module. This unit facilitates effective communication between devices in an automation system, functioning at optimal temperatures ranging from 0°C to 60°C.
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| Manufacturer | GE Fanuc Emerson |
|---|---|
| Product Type | Link I/O Modules |
| Product Line | Versamax |
| Part Number | IC600YB947 |
| Weight | 6.00 lbs (2.72 kg) |
| UPC | 146964184193 |
| Board Material | FR4 |
| Minimum Operating Temperature | 0°C |
| Maximum Operating Temperature | 60°C |
| Minimum Storage Temperature | -20°C |
| Maximum Storage Temperature | 70°C |
| Minimum Relative Humidity | 5% (non-condensing) |
| Maximum Relative Humidity | 95% (non-condensing) |
| Installation Altitude | 1000 m |
| Function | Acts as a specialized I/O Link Module |
| Screw Terminals | Bottom Screw Connectors |
The IC600YB947 from GE Fanuc Emerson is a robust link I/O module tailored for the Versamax series. Constructed from FR4 board material, this module performs effectively in operational settings with temperatures extending from 0°C to 60°C. In storage scenarios, it tolerates conditions ranging from -20°C to a maximum of 70°C.
The unit is designed to operate reliably in environments with relative humidity between 5% and 95% without condensation. This provides flexibility for installation in various locations. Additionally, it can be utilized at altitudes of up to 1000 meters, supporting diverse industrial applications.
This specialized I/O link module features bottom screw connectors for secure and straightforward wiring. The IC600YB947 is not only integral in enabling communication among devices in automation setups but also contributes to the overall efficiency of the control system.