C200HW-BC081-V1

The C200HW-BC081-V1 CPU backplane module from Omron, a crucial component within the industrial automation realm, is meticulously designed to empower and streamline PLC system expansion and connectivity. Purposefully engineered, it boasts eight meticulously crafted slots poised to seamlessly integrate additional input and output devices, thereby augmenting the overall functionality of your automation system. Operating at an esteemed rated voltage of 5V DC and demonstrating a modest current consumption of 70 mA, this backplane module ardently guarantees a stable power supply to the interconnected I/O modules, thus ensuring steadfast and reliable operation. Its structural integrity and resilience, emblematic of its robust construction, render it eminently suitable for the most demanding industrial settings, unfazed by the rigorous conditions they entail. It complies with the following standards of U, C, and CE. Exhibiting exceptional versatility, this module's operational gamut spans an impressive temperature range, effectively bridging the gap between 0°C to 55°C for operation and a storage milieu from -25°C to 70°C. Within the confines of a compact form factor measuring 40 x 140 x 113 mm, the C200HW-BC081-V1 beckons seamless integration into control panels or equipment enclosures where space is at a premium. Embodying a profound commitment to facilitating cogent communication, this backplane module orchestrates harmonious discourse between the PLC CPU and the interconnected I/O modules, accommodating diverse communication protocols such as the CJ-series communication bus and the CS1W/C200H/C200HX/HG/HE/ME-Network. This orchestration of connectivity bestows a panoply of flexible integration options, resulting in an automation ecosystem marked by peerless efficiency, synchronized operation, and unwavering dependability. In summary, the Omron C200HW-BC081-V1 backplane module emerges as an indispensable linchpin in the industrial automation tapestry, underpinning I/O module expansion and connectivity with aplomb, while exuding durability, adaptability, and seamless communication prowess.