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TSXP57304M
The TSXP57304M is a Unity Processor developed by Schneider Electric, designed for use in Modicon applications. It supports both 8-rack and 16-rack configurations, making it versatile for different setups.
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Technical specifications for TSXP57304M
| Manufacturer | Schneider Electric |
|---|---|
| Product Line | Modicon |
| Part Number | TSXP57304M |
| EAN | 3595863761566 |
| Weight | 2.06 lbs (0.94 kg) |
| Product Description | Unity Processor |
| Rack Options | 8-rack, 16-rack |
| No. of Slots (8-rack) | 12-slots |
| No. of Slots (16-rack) | 4/6/8-slots |
| Rated Current | 1.18 A |
| Voltage Rating | 5 VDC |
| Discrete I/O Processor Capacity | 1024 I/O |
| Analogue I/O Processor Capacity | 128 I/O |
| No. of Application Specific Channels | 32 |
| No. of Process Control Channels | 15 up to 45 simple loops |
| Operating Temperature | 0 to 40 degrees Celsius |
| Storage Temperature | 0 to 50 degrees Celsius |
The Schneider Electric TSXP57304M Unity Processor is engineered for flexible control in Modicon systems. This device can be integrated into both 8-rack and 16-rack setups. An 8-rack configuration supports up to 12 slots, catering to various input/output needs. In contrast, the 16-rack configuration can accommodate 4, 6, or 8 slots, providing adaptability based on specific requirements.
This processor operates under a voltage rating of 5 VDC, with a rated current of 1.18 A. It offers substantial processing capabilities, featuring 1024 discrete I/O and 128 analogue I/O capacities, enabling comprehensive control for various applications. Additionally, it supports 32 application-specific channels, facilitating focused task management, along with 15 to 45 channels for process control to handle simple loops effectively.
The operating temperature range for the TSXP57304M is between 0 to 40 degrees Celsius, ensuring reliable performance across typical industrial environments. Moreover, it is designed to withstand storage temperatures up to 50 degrees Celsius, making it suitable for diverse operating conditions.
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