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The Yaskawa JARCR-XCI03, part of the Motoman series, is a dedicated circuit board designed for various automation and robotics tasks. This board is compatible with general I/O systems, making it versatile for numerous applications.
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| Manufacturer | Yaskawa |
|---|---|
| Product Line | Motoman |
| Part Number | JARCR-XCI03 |
| Weight | 0.56 lbs (0.26 kg) |
| Type | Circuit Board |
| General I/O Board | Yes |
| Robotics Applications | Supported |
| Card Cage | Supported |
| Advanced Machining Applications | Supported |
| Milling Applications | Supported |
| Factory Automation Applications | Supported |
| Operating Temperature | 0 to 40 degrees Celsius |
| Storage Temperature | 0 to 50 degrees Celsius |
| Maximum Operating Humidity | 80% (non-condensing) |
| Maximum Storage Humidity | 80% (non-condensing) |
| Maximum Operating Altitude Without Derating | 1000 meters above sea level |
| Maximum Storage Altitude | 1000 meters above sea level |
| Environment | Clean indoor environment with no corrosive chemicals |
The JARCR-XCI03 model from Yaskawa's Motoman series functions as a crucial circuit board for enhancing both general I/O and robotics applications. This unit broadens its utility by also supporting advanced machining and milling applications, proving beneficial for factory automation. It operates effectively within the temperature range of 0 to 40 degrees Celsius, ensuring dependability in standard work environments.
When it comes to storage, this board can withstand temperatures from 0 to 50 degrees Celsius, maintaining its integrity even under varying conditions. Designed for clean indoor usage, the circuit board is not suited for environments with corrosive chemicals, which could compromise its functionality. It can tolerate humidity levels of up to 80%, provided they remain non-condensing.
Furthermore, the JARCR-XCI03 can operate at altitudes up to 1000 meters above sea level without experiencing derating, making it suitable for high-installation scenarios. The inclusion of card cage support ensures easy integration into existing systems, streamlining installation processes and enhancing its overall applicability in diverse industrial settings.