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JANCD-FC100C
The Yaskawa JANCD-FC100C is a high-interface control board designed for the YASNAC series, suitable for various industrial applications. It operates within an ambient temperature range of 0 °C to +53 °C and can function in conditions with 20% to 80% relative humidity. The device is designed to maintain performance even under vibrations of up to 4.9 m/s.
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Technical specifications for JANCD-FC100C
| Manufacturer | Yaskawa |
|---|---|
| Product Line | YASNAC |
| Part Number | JANCD-FC100C |
| Weight | 0.69 lbs (0.31 kg) |
| Ambient Temperature | 0 °C to +53°C |
| Humidity | 20% to 80% RH (with operation) |
| Vibration during Operation | Less than 4.9 m/s |
| Input Power Supply Voltage | 180V-264VAC |
| Frequency | 47 Hz to 63 Hz |
| PCB Type | Multi-layer |
| Laminated | Yes |
| Current Rating | 500mA |
| Function | High-Interface (HIF) Control Board |
| Mounting Holes | Yes |
The Yaskawa JANCD-FC100C is recognized as a High-Interface (HIF) control board specifically engineered for the YASNAC series. This module is capable of operating within a temperature range from 0 °C to a maximum of +53 °C. Furthermore, it can function efficiently in environments where humidity levels range from 20% to 80% relative humidity.
When it comes to operational resilience, the JANCD-FC100C can withstand vibrations up to 4.9 m/s, ensuring stability during various operations. It is powered through an input voltage ranging between 180 to 264 volts AC, making it suitable for diverse electrical systems. In addition, the frequency range for this model extends from 47 Hz to 63 Hz, catering to a variety of applications.
The control board features a multi-layer printed circuit board (PCB), laminated for enhanced durability and reliability. This construction is essential for prolonged performance under varying operational conditions. With a current rating of 500 mA, this control board is designed to handle adequate loads typical in industrial environments. For convenience during installation, the device includes mounting holes, simplifying the process of securing the module in place.
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