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GE Fanuc Emerson Series Six IC600BF947

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IC600BF947

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The IC600BF947 is an I/O module from the GE Fanuc Series Six line. This particular I/O Link Local Module is designed to seamlessly integrate with various compatible devices, including Series Six Plus PLCs and Series One and Series Three PLC I/O Modules.

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Technical specifications for IC600BF947

ManufacturerGE Fanuc Emerson
Product TypeI/O Module
Product LineSeries Six
Part NumberIC600BF947
Weight6.00 lbs (2.72 kg)
I/O Module TypeI/O Link Local Module
Link TypeCommunication Link with Diagnostics
Compatible DevicesSeries Six Plus PLCs, Slave Series One PLCs, Series Three PLC I/O Modules
Storage Temperature-20 to 70 degrees Celsius
Operating Temperature0 to 60 degrees Celsius
Non-Condensing Relative Humidity5 to 95%
Number of Supported RacksUp to 7 Remote Series One or Series Three Racks
Number of Accessible I/O Points with a Series One Rack96 I/O Points
Number of Accessible I/O Points with each Series Three Rack224 I/O Points

The IC600BF947 is a versatile I/O module designed for industrial applications in the GE Fanuc Emerson Series Six family. This I/O Link Local Module provides a structured communication link with built-in diagnostics. It is engineered for compatibility with Series Six Plus PLCs, Slave Series One PLCs, and Series Three I/O modules, enabling flexible configurations in control systems.

This module can support up to seven remote racks when integrated into a system, significantly enhancing the overall network capacity. Each Series One rack can manage up to 96 accessible I/O points, while the Series Three racks offer a larger capacity of 224 I/O points per rack.

The IC600BF947 module operates efficiently between 0 and 60 degrees Celsius, ensuring reliable performance in typical industrial conditions. For storage, it can withstand temperatures as low as -20 degrees and as high as 70 degrees Celsius. Furthermore, it accommodates a wide range of relative humidity, operating in environments with non-condensing humidity levels from 5% to 95%. This I/O module is built to deliver robust performance across various applications and environmental conditions.