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The IC600BF947 is an I/O module from the GE Fanuc Series Six line. This particular I/O Link Local Module is designed to seamlessly integrate with various compatible devices, including Series Six Plus PLCs and Series One and Series Three PLC I/O Modules.
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| Manufacturer | GE Fanuc Emerson |
|---|---|
| Product Type | I/O Module |
| Product Line | Series Six |
| Part Number | IC600BF947 |
| Weight | 6.00 lbs (2.72 kg) |
| I/O Module Type | I/O Link Local Module |
| Link Type | Communication Link with Diagnostics |
| Compatible Devices | Series Six Plus PLCs, Slave Series One PLCs, Series Three PLC I/O Modules |
| Storage Temperature | -20 to 70 degrees Celsius |
| Operating Temperature | 0 to 60 degrees Celsius |
| Non-Condensing Relative Humidity | 5 to 95% |
| Number of Supported Racks | Up to 7 Remote Series One or Series Three Racks |
| Number of Accessible I/O Points with a Series One Rack | 96 I/O Points |
| Number of Accessible I/O Points with each Series Three Rack | 224 I/O Points |
The IC600BF947 is a versatile I/O module designed for industrial applications in the GE Fanuc Emerson Series Six family. This I/O Link Local Module provides a structured communication link with built-in diagnostics. It is engineered for compatibility with Series Six Plus PLCs, Slave Series One PLCs, and Series Three I/O modules, enabling flexible configurations in control systems.
This module can support up to seven remote racks when integrated into a system, significantly enhancing the overall network capacity. Each Series One rack can manage up to 96 accessible I/O points, while the Series Three racks offer a larger capacity of 224 I/O points per rack.
The IC600BF947 module operates efficiently between 0 and 60 degrees Celsius, ensuring reliable performance in typical industrial conditions. For storage, it can withstand temperatures as low as -20 degrees and as high as 70 degrees Celsius. Furthermore, it accommodates a wide range of relative humidity, operating in environments with non-condensing humidity levels from 5% to 95%. This I/O module is built to deliver robust performance across various applications and environmental conditions.