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GE Fanuc Emerson Versamax IC200ACC303

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IC200ACC303

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The IC200ACC303 is an I/O shorting bar from the Versamax series by GE Fanuc Emerson. It is designed for efficient integration with I/O modules, featuring LED indicators that display the state of each I/O signal.

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Technical specifications for IC200ACC303

ManufacturerGE Fanuc Emerson
Product TypeI/O Shorting Bar
Product LineVersamax
Part NumberIC200ACC303
Weight0.13 lbs (0.06 kg)
Mounting MethodDIN rail snap-on mounting
Connector Type36-pin connector interface
Supported I/O PointsUp to 32 I/O
Common Power Connections4 shared connections
Latch MechanismLatch hole for module fastening
Contact TypeCrimped contacts for the wire ends
Terminal StyleFerrule-type terminal connections
Signal IndicationLED indicators for each I/O signal state
Backplane CommunicationProvides a backplane communication path for I/O modules
Field Wiring CapacityDirect-wiring capability to interposing I/O terminals
Cable AttachmentQuick-attach connector for pre-wired cables

The IC200ACC303, part of GE Fanuc Emerson's Versamax series, functions as an I/O shorting bar facilitating connections in modular systems. Weighing just 0.11 lbs, it efficiently mounts onto DIN rails using a snap-on method. This module achieves compatibility with up to 32 I/O points thanks to its 36-pin connector interface, which integrates seamlessly with various I/O configurations.

The device features four common power connections, allowing multiple modules to share power effectively. Each I/O signal state is visibly indicated through dedicated LED indicators, which enhance user monitoring capabilities.

For secure fastening, the IC200ACC303 incorporates a latch hole mechanism, providing additional stability to the module once mounted. In terms of wiring, crimped contacts allow for reliable connections at the wire ends, while ferrule-type terminal connections provide consistent performance.

This I/O shorting bar also includes a quick-attach connector, which makes connecting pre-wired cables a straightforward task. Furthermore, it enables backplane communication, ensuring that I/O modules can transfer data efficiently within the system. Enhanced field wiring capabilities allow for direct wiring to interposing I/O terminals, promoting flexibility in setup and installation.